发明名称 PRINTED CIRCUIT BOARD BASIC PLATE AND THE MANUFACTURING METHOD
摘要 PURPOSE: A basic plate for a printed circuit board and a manufacturing method thereof are provided to attach a copper film on a metallic board using a chamber with high internal temperature and pressure, thereby minimizing a failure rate of the plate. CONSTITUTION: A copper film(3) is attached and fixed to a metallic board(1) by pressurization and heat. A protection film(4) is attached to a surface of the copper film. A cut metallic board is fixed at a fixed interval. If the metallic board is fixed, a fixing cart(41) is mounted to shield a chamber(42). The copper film is bonded with the metallic board by making the temperature and pressure in the chamber high.
申请公布号 KR101022766(B1) 申请公布日期 2011.03.17
申请号 KR20100083913 申请日期 2010.08.30
申请人 JUNG, KI SUK 发明人 JUNG, KI SUK
分类号 H05K1/09;B32B15/20;H05K3/38 主分类号 H05K1/09
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