发明名称 A LED PACKAGE MANUFACTURING METHOD
摘要 PURPOSE: A method for manufacturing an LED package is provided to reduce manufacturing costs by coating fluorescent materials on the minimum area of the top side of a reflector through which light passes. CONSTITUTION: A mask(120) with a space(110) is installed on the upper side of a film(100). A fluorescent material(130) is inserted into the space. The fluorescent material is dried. The mask is removed. The film is cut to correspond to the upper side of a reflection unit.
申请公布号 KR101022540(B1) 申请公布日期 2011.03.17
申请号 KR20100081038 申请日期 2010.08.20
申请人 KIM, JONG YOUL;SUMTECH CO., LTD. 发明人 KIM, JONG YOUL
分类号 H01L33/50;H01L33/48;H01L33/60 主分类号 H01L33/50
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