发明名称 |
A LED PACKAGE MANUFACTURING METHOD |
摘要 |
PURPOSE: A method for manufacturing an LED package is provided to reduce manufacturing costs by coating fluorescent materials on the minimum area of the top side of a reflector through which light passes. CONSTITUTION: A mask(120) with a space(110) is installed on the upper side of a film(100). A fluorescent material(130) is inserted into the space. The fluorescent material is dried. The mask is removed. The film is cut to correspond to the upper side of a reflection unit.
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申请公布号 |
KR101022540(B1) |
申请公布日期 |
2011.03.17 |
申请号 |
KR20100081038 |
申请日期 |
2010.08.20 |
申请人 |
KIM, JONG YOUL;SUMTECH CO., LTD. |
发明人 |
KIM, JONG YOUL |
分类号 |
H01L33/50;H01L33/48;H01L33/60 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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