MAGNETRON SPUTTERING TARGET DEVICE FOR LARGE-SIZED SUBSTRATE

摘要

Disclosed is a magnetron sputtering target device for a large-sized substrate. The magnetron sputtering target device for the large-sized substrate of the present invention comprises: a sputtering target which is positioned to be separated from the large-sized substrate, and has a shape which covers all the thin film-formed parts of the large-sized substrate; a magnet which is positioned in the vicinity of the sputtering target to allow movement thereon; and a magnet moving means which moves the magnet so that the entire surfaces of the sputtering target may be scanned. According to the present invention, advantages include the small area occupied by the equipment and there is no need to expand the size of a chamber. Further, since the magnet moving means solves non-uniformity and inefficiency during the formation of thin films, which may occur when the large-sized substrate or the sputtering target does not move, the invention efficiently forms thin films and increases the quality of the formed thin films.