发明名称 |
SOLDERED STRUCTURE USING Zn AND METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldered structure in which structure characteristics are improved by intervening in interfacial reaction in the case of soldering high reactive Zn. <P>SOLUTION: The soldered structure includes a coupling layer containing Zn and Pb-free solder that coupling-reacts with the coupling layer. Then, the coupling layer has a multiple layer structure in which at least one material layer formed by a predetermined material and a Zn layer are sequentially laminated; and the Zn layer is located at the uppermost position on the Pb-free solder side of the multiple layer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011054978(A) |
申请公布日期 |
2011.03.17 |
申请号 |
JP20100228990 |
申请日期 |
2010.10.08 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHOI WON-KYOUNG;MOON CHANG-YOUL;SON YOON-CHUL;KIM YOUNG-HO;ROH HEE-RA;OH CHANG-YUL |
分类号 |
H05K3/24;B23K1/20;B23K101/42;H05K1/09;H05K3/34 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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