| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a modified polyimide which is favorable for a resin component of a composition for insulating film and whose cured insulating film (protective film) obtained by heat treatment hardly form a warp (non-curling property), is flexible, is excellent in heat resistance and resistance to soldering, has good adhesion to a wiring pattern, a polyimide film and a sealing material, and is excellent in solvent resistance, chemical resistance, flexure resistance and electric characteristics, the composition for insulating film using the modified polyimide and an epoxy compound, and the cured insulating film or the like. <P>SOLUTION: Polyimide resin obtained by reacting (a) a diisocyanate compound, (b) one or more diol compounds containing polybutadiene having bifunctional hydroxy groups at each terminal and (c) an imide oligomer having bifunctional hydroxy groups at each terminal, the composition for insulating film using the modified polyimide and an epoxy compound, and the cured insulating film thereof are provided. <P>COPYRIGHT: (C)2011,JPO&INPIT |
