| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method which can shorten takt time in laser beam machining, and a method for manufacturing semiconductor equipment. <P>SOLUTION: A laser beam L is modulated by means of a reflective spatial light modulator. While the modulated laser beam L is focused on an object 1 to be machined, the laser beam L is moved on the object 1 to be machined. At this time, the laser beam L is modulated by the spatial light modulator so that reformed spots S and S are formed, with the laser beam L focused on two separate places along the direction D in which the laser beam L is moved on the object 1 to be machined. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
