| 摘要 |
PROBLEM TO BE SOLVED: To obtain a flat laminating surface by reducing the occurrence of defects and irregularities on the lamination interface that is apprehended when two silicon wafers having different plane orientations are laminated directly. SOLUTION: A method is provided for manufacturing a laminated wafer including a step of laminating two silicon wafers having different plane orientations directly as an active layer wafer and a wafer for support substrate with no insulating film therebetween, and a step of thinning the active layer wafer. An amorphous layer is formed on the surface of at least one of two silicon wafers before they are laminated. COPYRIGHT: (C)2011,JPO&INPIT |
