发明名称 |
FABRICATION OF PASSIVE ELECTRONIC COMPONENTS |
摘要 |
A method for fabrication of passive electronic components includes disposing a sacrificial layer on a carrier and forming a curable resin layer on top of the sacrificial layer and patterning the curable resin to form a cured resin template having multiple pattern levels. A metal material is deposited into the first pattern level to form a first structure. A dielectric material is then formed on exposed portions of the first structure. A nonselective subtractive process is used to expose the sacrificial layer in a bottom of the second pattern level and metal material is deposited into the second pattern level and built up to include a portion which crosses over the dielectric material.
|
申请公布号 |
US2011063776(A1) |
申请公布日期 |
2011.03.17 |
申请号 |
US20090560284 |
申请日期 |
2009.09.15 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
BYRNE LORRAINE;DOOLEY KEVIN;FITZPATRICK DAVID |
分类号 |
H01G4/08;H01F5/00;H01F41/04;H01G4/00 |
主分类号 |
H01G4/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|