发明名称 APPARATUSES FOR ATOMIC LAYER DEPOSITION
摘要 Embodiments of the invention provide apparatuses for atomic layer deposition (ALD), such as plasma-enhanced ALD (PE-ALD). In one embodiment, an inlet manifold assembly is provided which includes an annular channel encompassing a centralized channel, wherein the centralized channel extends through the inlet manifold assembly and injection holes extending from the annular channel, through a sidewall of the centralized channel, and to the centralized channel. The injection holes have a first plurality of injection holes extending towards or substantially towards a central axis of the centralized channel and the injection holes have a second plurality of injection holes extending tangential or substantially tangential towards the sidewall of the centralized channel.
申请公布号 KR20110028377(A) 申请公布日期 2011.03.17
申请号 KR20117002540 申请日期 2009.07.02
申请人 APPLIED MATERIALS, INC. 发明人 LAM HYMAN;ZHENG BO;HUA AI;JACKSON MICHAEL;YUAN XIAO XIONG;WANG HOU GONG;UMOTOY SALVADOR P.;YU SAN HO
分类号 H01L21/205 主分类号 H01L21/205
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