| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a package structure capable of reducing a cost, relating to a flip chip semiconductor package technology. SOLUTION: A package substrate 2a' of a large area is cut into a plurality of package substrate blocks 2b containing a plurality of package substrate units 2c. Each package substrate unit 2c is loaded with a semiconductor chip, which is secured with a package material and is protected. A plurality of package structure blocks containing a package structure unit are formed. The package structure block is cut to form a plurality of package structure units. COPYRIGHT: (C)2011,JPO&INPIT
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