SEMICONDUCTOR CHIP WITH STAIR ARRANGEMENT BUMP STRUCTURES

摘要

Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first conductor structure on a first side of a semiconductor chip and forming a second conductor structure in electrical contact with the first conductor structure. The second conductor structure is adapted to be coupled to a solder structure and includes a stair arrangement that has at least two treads.