| 摘要 |
1,248,142. Printed circuits. DECCA Ltd. 17 June, 1970 [20 June, 1969], No. 31384/69. Heading H1R. A method of making an electrical circuit assembly comprises coating a substrate of glass or ceramic plate with a resistive layer of chromium or nickel-chromium alloy 300 Š thick by evaporation or sputtering, coating the whole resistive layer with gold 2000-4000 Š thick by a vacuum deposition technique, selectively removing the gold and resistive layers from those areas where neither resistive elements nor conductive elements are to be formed, selectively plating with gold the regions of the desired conductive elements and selectively removing the gold layer by etching from the regions of the desired resistive elements. Adhesion layers of chromium or titanium and copper can be provided between the resistive and gold layers. In the gold plating process the resistive layer is used as the cathode.
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