METHOD OF MANUFACTURING SUBSTRATE WITH THROUGH ELECTRODE, AND SUBSTRATE WITH THROUGH ELECTRODE

摘要

PROBLEM TO BE SOLVED: To provide a means of efficiently manufacturing a substrate with a through electrode to be used for high-density packaging of a chip device. SOLUTION: Manufacturing processes of the substrate with the through electrode includes: a process of suspending particulates of a conductor material constituting the through electrode in a liquid; a process of bringing a filter layer 140 that the particulates of the conductive material do not pass through and only the liquid can pass through into contact with one surface of a substrate 101 having a through hole 102; a process of pouring the suspension 130 in the through hole while applying pressure to deposit the conductor particulates in the through hole; a process of drying the liquid wetting the conductor particulates deposited in the through hole; and a process of injecting conductive paste into the through hole wherein the conductor particulates are deposited, and then drying and hardening them. A method of forming a through electrode by using particulates made of alloy as the conductor particulates and melting them at a temperature above the melting point of the alloy, and cooling and solidifying them is available. COPYRIGHT: (C)2011,JPO&INPIT