发明名称 |
THERMAL CONDUCTIVE SHEET AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost thermal conductive sheet having high thermal conductivity and high heat resistance properties. SOLUTION: The thermal conductive sheet includes a thermal conductive resin layer, where a blend ratio of a thermal conductive filler to a thermoplastic resin is 10-90: 90-10 on a volume ratio, wherein the thermal conductive resin layer is a thermoplastic crosslinking type resin and crosslinking is performed by applying electron rays. The thermoplastic crosslinking type resin is an ethylene-acrylate-maleic anhydride copolymer, and a thermal shrinkage ratio is not more than 5%. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011054705(A) |
申请公布日期 |
2011.03.17 |
申请号 |
JP20090201391 |
申请日期 |
2009.09.01 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YAGI IZUMI;UEKI TAKAYUKI;KUROKI JUNICHI;TAGUCHI TOMOHIRO |
分类号 |
H05K7/20;C08J7/00;C08K3/00;C08L23/08;H01L23/36;H01L23/373 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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