| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which attempts to uniformize a contact resistance of a wiring extending part to an underlying semiconductor substrate of multilayer wiring. SOLUTION: The semiconductor integrated circuit device has the semiconductor substrate, multilayer wirings laid in a plurality of layers on the semiconductor substrate, a hookup part 73 which is formed in the wiring extending region as an extension part of the wiring, and is composed of a pair of metal pieces opposed via a space of a given width, and a contact conductor 72 buried so as to penetrate the space of the metal piece pair of the hookup part. A space width of the metal piece pair of the hookup part is different between at least two layers of the wiring. COPYRIGHT: (C)2011,JPO&INPIT
|
