| 摘要 |
PROBLEM TO BE SOLVED: To suppress a generation of a void generated in solder for connecting a lower surface electrode pad to a lower surface electrode land. SOLUTION: An electronic circuit board has an electronic component 12 having a peripheral electrode pad 20 and a lower surface electrode pad 22 on a lower surface 12a, a printed board 14 having a peripheral electrode land 24 connected with a peripheral electrode pad by first solder 28 and a lower surface electrode land 26 connected with a lower surface electrode pad by second solder 30 on an upper surface 14a, and a sealed space 18 surrounded by the peripheral electrode pad, the peripheral electrode land, the first solder, flux 16, the upper surface of the printed board, and the lower surface of the electronic component. A through hole 32 which penetrates the lower electrode land and the printed board and in which a metal film is not formed on an inner wall surface 32a is formed at the lower surface electrode land of the printed board. COPYRIGHT: (C)2011,JPO&INPIT
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