发明名称 THERMAL CONDUCTIVE SHEET AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a low-cost thermal conductive sheet having high thermal conductivity and high heat resistance properties. SOLUTION: The thermal conductive sheet includes a thermal conductive resin layer, where a blend ratio of a thermal conductive filler to a thermoplastic resin is 10-90: 90-10 on a volume ratio, wherein the thermal conductive resin layer is crosslinked by applying electron rays, the thermoplastic resin is a block copolymer with ethylene and octene as main constituents, and a thermal shrinkage ratio is not more than 5%. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011054706(A) 申请公布日期 2011.03.17
申请号 JP20090201407 申请日期 2009.09.01
申请人 DAINIPPON PRINTING CO LTD 发明人 YAGI IZUMI;UEKI TAKAYUKI;KUROKI JUNICHI;TAGUCHI TOMOHIRO
分类号 H05K7/20;C08J7/00;C08K3/00;C08L53/00;C08L101/00;H01L23/36;H01L23/373 主分类号 H05K7/20
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