| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer carrying device capable of being adapted to high-speed separation processing, and securely separating and conveying wafers to following processes even if the wafers are partially put one over the other underwater to come into contact with each other. SOLUTION: The wafer carrying device 8 that carries wafers in water, which are separated from a wafer stack WS by a wafer separator device and supplied one after another, to the surface of the wafer is provided with a first endless belt type carrying device 4 which carries the successively supplied wafers W to the surface of the water, and a second endless belt type carrying device 5 which is located downstream in the wafer carrying direction of the first endless belt type carrying device 4, and takes over and carries the wafers W carried by the first endless belt type carrying device 4. The second endless belt type carrying device 5 brings its endless belt into contact with the surface of each wafer W on the opposite side from its wafer stack side in a wet state to carry the wafer W. COPYRIGHT: (C)2011,JPO&INPIT |
