METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to form a protective film with a fixed width expanded along an external end, thereby preventing teeth missing of the semiconductor substrate. CONSTITUTION: A surface protection tape(13) is attached to a surface(1a) of a semiconductor substrate(1). The semiconductor substrate is absorbed by a wafer absorbing layer installed on a chuck stage(17). Mixed acid is discharged toward a rear side(1b) of the semiconductor substrate through a chemical liquid discharging nozzle(9). The mixed acid flows toward an external end of the semiconductor substrate by a centrifugal force. A fracturing layer of the semiconductor substrate is removed by the mixed acid.