发明名称 |
A METHOD FOR RECOVERING TIN AND SILVER FROM LEAD FREE SOLDER BALL USING METAL SOLVENT |
摘要 |
<p>PURPOSE: A method of recovering tin and silver from lead-free solder balls using a metal solvent is provided to enable silver and tin to be recovered at a high yield rate of 95% or higher. CONSTITUTION: A method of recovering tin and silver from lead-free solder balls using a metal solvent is as follows. Non-metal impurities having a high melting point and an organic volatile material are removed by the melting of the lead-free solder ball. The metal solvent is added to the lead-free solder balls, is melted, and is made into alloys. A firstly melted alloy material is cooled, stirred, and divided into silver-enriched alloy of a coagulated dross type and tin-silver-metal solvent alloy of a melted-metal type. The metal solvent is added to the tin-silver-metal solvent alloy of a melted-metal type is melted and made into alloys. A secondly melted alloy material is cooled, stirred, and divided into a silver-enriched alloy of a coagulated-dross type and tin-metal solvent alloy of a melted-metal type.</p> |
申请公布号 |
KR20110027304(A) |
申请公布日期 |
2011.03.16 |
申请号 |
KR20090085329 |
申请日期 |
2009.09.10 |
申请人 |
KOREA INSTITUTE OF GEOSCIENCE AND MINERAL RESOURCES(KIGAM) |
发明人 |
KIM, BYUNG SU;LEE, JAE CHUN |
分类号 |
C22B11/00;C22B7/00;C22B25/00 |
主分类号 |
C22B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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