| 摘要 |
PURPOSE: A chip leveling device is provided to reduce quality deviation of an external electrode by reducing the coating thickness deviation of the external electrode through the constant protrusion height of chips inserted into a carrier plate. CONSTITUTION: A lifting device(40) is installed in a frame to lift an upper head(50). The lifting device is comprised of a servo motor(41), a lead screw(42), a ball nut(43), a carriage(44), and a linear motion guide(45). The servo motor provides a driving force to an overhead frame(46) installed on the upper side of the frame. The linear motion guide is comprised of a plurality of guide bars(45a). The guide bar penetrates through the carriage to guide the linear movement of the carriage. |
