发明名称 A CARRIER MEMBER FOR MANUFACTURING A SUBSTRATE AND A METHOD OF MANUFACTURING A SUBSTRATE USING THE SAME
摘要 PURPOSE: A carrier member for manufacturing a substrate and a manufacturing method thereof are provided to remove a routing process and repetitively use the same carrier member, thereby simplifying a manufacturing process. CONSTITUTION: A carrier core layer(10) supports a printed circuit board. A concavo-convex part(20) is formed in an edge area of the carrier core layer. The concavo-convex part includes a protrusion type concavo-convex part and a groove type concavo-convex part. A releasing layer(30) is formed on the carrier core layer. A step part is formed in the edge area of the carrier core layer. The groove type concavo-convex part is coupled with the step part.
申请公布号 KR101022943(B1) 申请公布日期 2011.03.16
申请号 KR20090096959 申请日期 2009.10.12
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, JEONG WOO;SOHN, KEUNG JIN;CHANG, TAE EUN;PARK, JUNG HWAN;OH, CHANG GUN
分类号 H05K1/14 主分类号 H05K1/14
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