发明名称 Radiating Package Module in Exothermic Element
摘要 Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability.
申请公布号 KR101022928(B1) 申请公布日期 2011.03.16
申请号 KR20090078131 申请日期 2009.08.24
申请人 发明人
分类号 H01L23/36;H01L33/64 主分类号 H01L23/36
代理机构 代理人
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