发明名称 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
摘要 Disclosed is a laser processing apparatus for processing a substrate to be processed which is used for a solar cell.  The laser processing apparatus comprises a holding part (65) for holding a substrate (60) to be processed, a laser oscillator (1) which irradiates the substrate (60) with a laser light (L) and processes the substrate (60), and a moving mechanism (5) for moving the irradiation position of the laser light (L) relative to the substrate (60) held by the holding part (65).  The laser processing apparatus is also provided with a coating mechanism (10) for sequentially applying a protective material onto portions of the substrate (60) which are processed by the laser light (L).
申请公布号 KR20110027755(A) 申请公布日期 2011.03.16
申请号 KR20117000187 申请日期 2009.06.03
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 KOYAMA HIROTAKA
分类号 B23K26/16;B23K26/08;B23K101/40;H01L31/04 主分类号 B23K26/16
代理机构 代理人
主权项
地址