ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

摘要

PURPOSE: An electroplating apparatus and method are provided to prevent the reduction of coating quality without frequent changes of a filter by controlling the dissolved oxygen concentration of plating liquid. CONSTITUTION: An electroplating apparatus(11) comprises a plating bath(13) which stores plating liquid, a separate bath(15) which is separated from the plating bath, and a return pipe(41) which returns the plating liquid from the separate tub to the plating tub. The separate bath comprises a first space(17) and a second space(19) which are divided by a partition wall(21) extended in the vertical direction. The extra plating liquid of the first space over the specific level is delivered to the second space.