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发明名称
A multilayer printed circuit board and a fabricating method the same
摘要
申请公布号
KR101022965(B1)
申请公布日期
2011.03.16
申请号
KR20080105356
申请日期
2008.10.27
申请人
发明人
分类号
H05K3/46;H05K1/02
主分类号
H05K3/46
代理机构
代理人
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