METHOD FOR INSPECTING A WAFER SHAPE AND METHOD FOR HEAT TREATMENT A WAFER USING THE SAME

摘要

PURPOSE: A method for inspecting the shape of a wafer and a method for thermally processing the wafer by applying the same are provided to improve the thermal process efficiency of the wafer by directly inspecting the shape of the wafer on a plate. CONSTITUTION: A wafer(W) is loaded on the upper side of a plate(100). A plurality of support pins(110) are installed on the upper side of the plate to support the wafer. A temperature sensor(200) senses the temperature of the plate. A heating unit(300) generates heat by the drive power applied from the outside. A control unit(400) controls the drive power applied to the heater.