| 摘要 |
PURPOSE: A manufacturing method an electric device embedded printing circuit substrate is provided to shorten manufacturing process time by hardening an insulation layer and an attachment film through an ultrasonic wave. CONSTITUTION: An attachment film(500) is spread on the lower-part of an electronic component(300). The electronic component is mounted on electronic component supplying unit(100) by an electronic component pickup tool(710) of an electronic component mounting. An insulating material(900) is spread on the electronic component and the electronic component supplying unit. The electronic component is fixed on the electronics component supplying unit by hardening the insulating material and the attachment film. The insulating material and the attachment film are hardened by an ultrasonic wave hardening apparatus(730) of the electronic component mounting. |
