发明名称 |
ELECTROMAGNETIC INTERFERENCE NOISE REDUCTION BOARD USING ELECTROMAGNETIC BANDGAP STRUCTURE |
摘要 |
PURPOSE: A printed circuit board for reducing EMI noise is provided to insert an electromagnetic band gap structure into an edge, thereby preventing noise in the board. CONSTITUTION: The first area(100) comprises a ground layer and a power layer. The second area(200) prevents EMI noise emitted through a side of the first area. The second conductive plate(220) is overlapped with the first conductive plate. A through via(250) connects the first and second conductive plates. The first area and the second area are made of at least four layers. A connection line(260) electrically connects the first conductive plate with a ground layer.
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申请公布号 |
KR101021552(B1) |
申请公布日期 |
2011.03.16 |
申请号 |
KR20090089666 |
申请日期 |
2009.09.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
BONG, KANG WOOK;KIM, HAN;HAN, MI JA |
分类号 |
H05K1/02;H05K3/46;H05K9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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