发明名称 Heat removal system for computer rooms
摘要 According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.
申请公布号 US7907395(B2) 申请公布日期 2011.03.15
申请号 US20090404784 申请日期 2009.03.16
申请人 RAYTHEON COMPANY 发明人 WEBER RICHARD M.;WYATT WILLIAM G.
分类号 G06F1/20;H05K5/00;H05K7/20 主分类号 G06F1/20
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