发明名称 |
Heat removal system for computer rooms |
摘要 |
According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.
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申请公布号 |
US7907395(B2) |
申请公布日期 |
2011.03.15 |
申请号 |
US20090404784 |
申请日期 |
2009.03.16 |
申请人 |
RAYTHEON COMPANY |
发明人 |
WEBER RICHARD M.;WYATT WILLIAM G. |
分类号 |
G06F1/20;H05K5/00;H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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