发明名称 STRUCTURE AND METHOD FOR ASSEMBLING OF CAMERA MODULE
摘要 PURPOSE: A structure and a method for assembling camera module are provided to freely design a substrate by eliminating the need of forming a through hole. CONSTITUTION: A lower part of a lens holder(210) is connected to one side of a substrate(231). The substrate is attached to an image sensor(250). A plurality of guide bumps(235) are formed on the substrate according to the bump forming stage of assembling method. Therefore, a penetration of a foreign material and the contamination of the camera module due to a bonding material are prevented.
申请公布号 KR20110026320(A) 申请公布日期 2011.03.15
申请号 KR20090084166 申请日期 2009.09.07
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, WOON HA
分类号 H04N5/225 主分类号 H04N5/225
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