发明名称 Electronic device and method for manufacturing same
摘要 An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.
申请公布号 US7907093(B2) 申请公布日期 2011.03.15
申请号 US20080133410 申请日期 2008.06.05
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HONDA SATORU;HONDA TOMOKO;KUROIWA NOBUYOSHI;NAKAHATA MASAOMI;MORIMOTO JUN;HATA YOSHIKAZU;SATO KOICHI;TSUJIMURA AKIHIRO;TABATA MAKOTO;SAKURAI MINORU;KATO SHOJI
分类号 H01Q1/24 主分类号 H01Q1/24
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