| 摘要 |
PURPOSE: A build-up printed circuit board with via-holes of stack type using a bump structure and manufacturing method of the same are provided to implement two stack type printed circuit board through one process by a detachable carrier including first and second copper films. CONSTITUTION: In a build-up printed circuit board with via-holes of stack type using a bump structure and manufacturing method of the same, at least one internal layer is formed on both sides of a detachable carrier. The detachable carrier has a lamination structure of double copper layer on the both sides of an insulating layer. The detachable carrier is separated to form a detachable internal layer. A filling bump of a via hole filling mode is formed on the outer layer of the detachable layer. The outer-most base layer is formed by filling bump.
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