发明名称 Methods for forming small-scale capacitor structures
摘要 The present disclosure provides small scale capacitors (e.g., DRAM capacitors) and methods of forming such capacitors. One exemplary implementation provides a method of fabricating a capacitor that includes sequentially forming a first electrode, a dielectric layer, and a second electrode. At least one of the electrodes may be formed by a) reacting two precursors to deposit a first conductive layer at a first deposition rate, and b) depositing a second conductive layer at a second, lower deposition rate by depositing a precursor layer of one precursor at least one monolayer thick and exposing that precursor layer to another precursor to form a nanolayer reaction product. The second conductive layer may be in contact with the dielectric layer and have a thickness of no greater than about 50 Å.
申请公布号 US7906393(B2) 申请公布日期 2011.03.15
申请号 US20040767298 申请日期 2004.01.28
申请人 MICRON TECHNOLOGY, INC. 发明人 ZHENG LINGYI A.;DOAN TRUNG T.;BREINER LYLE D.;PING ER-XUAN;BEAMAN KEVIN L.;WEIMER RONALD A.;BASCERI CEM;KUBISTA DAVID J.
分类号 H01L21/8242;H01L21/02;H01L21/314 主分类号 H01L21/8242
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