发明名称 Lid assembly for a processing system to facilitate sequential deposition techniques
摘要 A lid assembly for a semiconductor processing system is provided. The lid assembly generally includes a lid having first and second opposed surfaces, a plurality of controllable flow channels extending from the first and second opposed surfaces and a gas control system disposed on the first surface and operably opening and closing the channels. The gas control system includes a gas manifold disposed on the lid, at least one valve coupled to the gas manifold and adapted to control a flow through one of the flow channels, a reservoir fluidly connected to the gas manifold, and a precursor source fluidly connected to the reservoir.
申请公布号 US7905959(B2) 申请公布日期 2011.03.15
申请号 US20040993924 申请日期 2004.11.19
申请人 APPLIED MATERIALS, INC. 发明人 TZU GWO-CHUAN;UMOTOY SALVADOR P.
分类号 C23C16/452;C23C16/44;C23C16/455;H01L21/00;H01L21/50 主分类号 C23C16/452
代理机构 代理人
主权项
地址