发明名称 Product e.g. integrated electronic circuit, manufacturing method for small series and/or industrially large-scale production, involves chemically interconnecting atoms and/or molecules as crystals by changing of physical conditions
摘要 #CMT# #/CMT# The method involves incorporating and applying materials for a housing, electrical or thermal connections or conductors. Atoms and/or molecules are chemically interconnected as individual crystals by embracing and/or changing of physical conditions. Particles from appropriate reservoirs are splitted, filtered and brought in a define path direction and speed at an inlet of a measuring-steering-chamber. The particles from an outlet of the chamber are transferred to an inlet. Distances transverse to a particle direction are reduced. #CMT# : #/CMT# An independent claim is also included for a device for implementing a method for manufacturing a product by computer-controlled defragmenting of atoms and/or molecules. #CMT#USE : #/CMT# Method for manufacturing a product e.g. integrated electronic circuit, discrete or combined electronic element such as transistor, electronic detector, sensor, probe, image converter and energy store, materials with special chemical and/or physical characteristics such as vitamins, material structures and nano and microstructures, medicine such as docking medicine, docking robot, docking device, docking material, optical element or system such as microrobot, nanorobot, structure or circuits of graphics and nanotubes and/or threads (all claimed) and integrated microprocessor, in viewable and/or non-viewable areas in small series and/or in industrial large-scale production by computer-controlled defragmenting of atoms and/or molecules. #CMT#ADVANTAGE : #/CMT# The method enables accurate controlled defragmentation of the material structures from same and/or different atoms and/or molecules or molecule parts by electrical and/or magnetic fields and physical and/or technical processes. The method ensures efficient mass production even with small wafers or as unique pieces without requiring lithography process. The method ensures limitation of the maximum dimensions only by the dimensions of the production chamber. The method enables elimination of the need for corroding, photo lacquering, exposure with short wavelength, lithography stencils with their positioning, special lens for very short wavelengths.
申请公布号 CH701762(A2) 申请公布日期 2011.03.15
申请号 CH20090001417 申请日期 2009.09.14
申请人 MARKUS R. MUELLER 发明人 MARKUS R. MUELLER
分类号 G06F7/00;B82B3/00 主分类号 G06F7/00
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