发明名称 Photomask, photomask superimposition correcting method, and manufacturing method of semiconductor device
摘要 In a photomask in which a device pattern, an alignment mark and a superimposition inspection mark are formed on a light transmitting base, each of the alignment mark and the superimposition inspection mark includes a main mark portion, and first and second auxiliary pattern portions. The main mark portion is constituted of one of a space pattern and a line pattern, the pattern having a linear width to be resolved on a photosensitive film formed on a semiconductor wafer, and each of the first and second auxiliary pattern portions includes an auxiliary pattern constituted of one of a repeated pattern of a space pattern and a repeated pattern of a line pattern, the repeated pattern having a linear width not to be resolved on the photosensitive film. The pitch of the repeated pattern is equal to the minimum pitch of the device pattern.
申请公布号 US7906258(B2) 申请公布日期 2011.03.15
申请号 US20080047516 申请日期 2008.03.13
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KOMINE NOBUHIRO;ISHIGO KAZUTAKA;SASAKI NORIAKI;HATANO MASAYUKI
分类号 G03C5/00;G03F1/36;G03F1/42;G03F7/20;H01L21/00;H01L21/027 主分类号 G03C5/00
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