发明名称 Circuit board including stubless signal paths and method of making same
摘要 A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
申请公布号 US7907418(B2) 申请公布日期 2011.03.15
申请号 US20090628778 申请日期 2009.12.01
申请人 INTEL CORPORATION 发明人 MEIER PASCAL;DABRAL SANJAY
分类号 H05K7/00 主分类号 H05K7/00
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