发明名称 Multilayer anisotropic, conductive adhesive and joining structure using this
摘要 A multilayer anisotropic conductive adhesive a plurality of adhesive layers that are laminated, each of which contains an insulating resin and a hardening agent. The conductive particles are contained either in a first plurality of adhesive layers or in a second plurality of adhesive layers, and at least the top or bottom adhesive layer has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Also, a connection structure is constructed in which a first electronic component having an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the multilayer anisotropic conductive adhesive.
申请公布号 KR101021437(B1) 申请公布日期 2011.03.15
申请号 KR20067004969 申请日期 2004.09.09
申请人 发明人
分类号 C09J9/02;C09J7/00;C09J9/00;H01R4/04;H05K3/32 主分类号 C09J9/02
代理机构 代理人
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