发明名称 |
Rapid cooling system for RTP chamber |
摘要 |
A rapid cooling system for a rapid thermal processing chamber includes a rapid thermal processing chamber having a wafer support for supporting a wafer. A tank having a supply of cooling liquid is provided in fluid communication with the chamber. A pump is provided in fluid communication with the rapid thermal processing chamber and the tank for pumping the cooling liquid from the tank to the chamber and cooling the wafer during the cooling phase of rapid thermal processing.
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申请公布号 |
US7905109(B2) |
申请公布日期 |
2011.03.15 |
申请号 |
US20050226721 |
申请日期 |
2005.09.14 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HWANG CHIEN LING;LIN YU-LIANG;TIEN FU-KANG;SHEU JYH-CHEMG |
分类号 |
F25D17/02 |
主分类号 |
F25D17/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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