发明名称 |
Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structure |
摘要 |
A semiconductor integrated circuit package, a printed circuit board, a semiconductor apparatus, and a power supply wiring structure that allow attainment of stable power source and ground wiring without causing resonance even in a high-frequency bandwidth are provided. In an interior portion of the package, a power source wiring and a ground wiring constitute a pair wiring structure in which the power source wiring and the ground wiring are juxtaposed at a predetermined interval so as to establish electromagnetic coupling therebetween. A plurality of pair wiring structures are combined in such a manner that, when viewed in a section perpendicular to a wiring extending direction, the pair wiring assembly assumes a staggered (checkered) configuration. It is preferable that, each of the silicon chip and the printed circuit board, like the package, has pair wiring structures disposed inside. |
申请公布号 |
US7906840(B2) |
申请公布日期 |
2011.03.15 |
申请号 |
US20080204677 |
申请日期 |
2008.09.04 |
申请人 |
KYOCERA CORPORATION;OKI ELECTRIC INDUSTRY CO., LTD.;KABUSHIKI KAISHA TOSHIBA;FUJI XEROX CO., LTD.;FUJITSU MICROELECTRONICS LIMITED;RENESAS TECHNOLOGY CORP.;IBIDEN CO., LTD.;KANJI OTSUKA;YUTAKA AKIYAMA |
发明人 |
OTSUKA KANJI;AKIYAMA YUTAKA |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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