| 摘要 |
The disclosure, in one aspect, provides an electronics package 100 comprising comprises a substrate 105 and a metal film 110 plated to a surface 107 of the substrate. The metal film has a polycrystalline structure of grains 120 having substantially anisotropic crystal unit cell dimensions. One dimension 130 of the crystal unit cells 125 are oriented in a direction 135 that is substantially perpendicular to the substrate surface for at least about 80 percent of the grains. Metal atoms of the metal film have a slower lattice diffusion coefficient along the perpendicularly-oriented unit cell dimension than along others of the unit cell dimensions 132, 134. |
