发明名称 ALUMINUM PLATING PROCESS
摘要 A process for depositing a metallic aluminum film on a substrate material which comprises: depositing a transition metal catalyst on said substrate; depositing an aluminum hydride compound on said substrate in contact with said catalyst; contacting said treated substrate in a heated bath consisting of an inert liquid, thereby decomposing said aluminum hydride material and providing a metallic aluminum coating on said substrate; removing said aluminum coated substrate from said bath and removing said inert liquid to provide said metallic aluminum coating on the substrate.
申请公布号 US3639139(A) 申请公布日期 1972.02.01
申请号 USD3639139 申请日期 1968.10.07
申请人 DOW CHEMICAL CO.:THE 发明人 ROGER G. SCHNEGGENBURGER;REINHOLD HELLMANN
分类号 C23C18/02;(IPC1-7):C23C3/04 主分类号 C23C18/02
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