发明名称 |
SOLID TYPE HEAT DISSIPATION DEVICE |
摘要 |
Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.
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申请公布号 |
US2011056671(A1) |
申请公布日期 |
2011.03.10 |
申请号 |
US20100765120 |
申请日期 |
2010.04.22 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
MOON SEOK-HWAN;KANG SEUNG YOUL;CHO KYOUNG IK;CHU MOO JUNG |
分类号 |
F28F7/00 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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