发明名称 SOLID TYPE HEAT DISSIPATION DEVICE
摘要 Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.
申请公布号 US2011056671(A1) 申请公布日期 2011.03.10
申请号 US20100765120 申请日期 2010.04.22
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 MOON SEOK-HWAN;KANG SEUNG YOUL;CHO KYOUNG IK;CHU MOO JUNG
分类号 F28F7/00 主分类号 F28F7/00
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