发明名称 POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION
摘要 The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.
申请公布号 US2011059397(A1) 申请公布日期 2011.03.10
申请号 US20090921281 申请日期 2009.03.06
申请人 LG CHEM, LTD. 发明人 SEONG HYE-RAN;PARK CHAN-HYO;OH DONG-HYUN;SHIN HYE-IN;KIM KYUNG-JUN;SHIN SE-JIN
分类号 G03F7/039 主分类号 G03F7/039
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