SEMICONDUCTOR CHIPS HAVING GUARD RINGS AND METHODS OF FABRICATING THE SAME
摘要
PURPOSE: A semiconductor chips and a manufacturing method thereof are provided to improve the reliability of an integrated circuit by preventing the generation of the crack within the insulation layers. CONSTITUTION: A semiconductor substrate(10) comprises a main chip area and a scribe lane area that surrounds the main chip area. An insulating layer(31) is arranged on the semiconductor substrate. A guard ring(34) is formed within the insulating layer within the scribe lane area. The guard ring surrounds at least a part of the main chip area.
申请公布号
KR20110025526(A)
申请公布日期
2011.03.10
申请号
KR20090083632
申请日期
2009.09.04
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, JUNG DO;KIM, JONG KOOK;LEE, SEOK WON;LEE, JAE SIK;IM, HO HYEUK;PARK, SU MIN