| 摘要 |
PURPOSE: A method for manufacturing a printed circuit board is provided to form a conductive circuit in a substrate by forming a seed layer for electroplating on the inside of an opening and the surface of a substrate. CONSTITUTION: In a method for manufacturing a printed circuit board, an opening(71) is formed in a substrate(30). A seed layer for electroplating is formed on the inside of an opening and the surface of the substrate. An electroplating film is formed on the substrate. The opening is filled with the electroplating film. A conductive circuit(158) is formed on the substrate. .
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