| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device capable of improving heat radiation from an electronic module without increasing package dimensions. <P>SOLUTION: A socket connector 10 has a housing 24 having a fitting edge 26 and a mounting edge 28, and a contact 40 has a fitting edge 50 exposed in a receiving section in order to fit into the electronic module 14. A thermally-conductive insert 44 is retained in the housing 24, and is arranged so as to thermally connect with a circuit board 12 when the housing 24 is mounted on a circuit board 12. The thermally-conductive insert has a module connection interface 56 arranged so as to thermally connect with the electronic module 14 when the electronic module 14 is inserted into the receiving section, and heat is transferred from the electronic module 14 to the circuit board 12. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
