| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component supply device capable of reducing component suction failure by a component suction nozzle when a chip component reaching a taking-out position is separated and carried out. <P>SOLUTION: The electronic component supply device 1 for supplying the chip components P stored in a random pile state in an electronic component storage case 14 to the taking-out position 38 includes component supply rails 16 and 16a for aligning the chip components P guided from the electronic component storage case in a row, vibrators 22a and 22b for moving the chip component P to the taking-out position by applying vibration to the component supply rail, and a stopper member 46 disposed in the taking-out position 38 on a downstream end of the component supply rail. The stopper member includes a minute vibration stopper 48 for stopping the chip component P1 at the taking-out position by being abutted to the chip component P1 reaching the taking-out position and applying vibration only for a minute distance. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
