| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device capable of economically dividing a warped package substrate. SOLUTION: In the cutting device provided with a holding table for holding a packaging substrate, the holding table includes: a plurality of cutting blade escape grooves each formed in a position corresponding to a division-scheduled line of a holding surface holding the packaging substrate; a plurality of suction holes formed in each area defined by the cutting blade escape grooves; and a negative pressure transmission part which transmits negative pressure to suck the packaging substrate to the holding table. The negative pressure transmission part includes: a plurality of central area negative pressure transmission parts which communicates with the center part of each suction area to suck and hold the package substrate when the package substrate is largely divided to reduce the warp; and a plurality of outer circumferential area negative pressure transmission parts, which acts on the center area negative pressure transmission part independently, and communicates with the outer circumferential part of each suction area for sucking and holding the package substrate together with the center area negative pressure transmission part when the package substrate is divided into individual packages. COPYRIGHT: (C)2011,JPO&INPIT |
